Please use this identifier to cite or link to this item: http://ir.juit.ac.in:8080/jspui/jspui/handle/123456789/9227
Title: Analytical modelling of microstrip-like interconnections in presence of ground plane aperture
Authors: Sharma, R
Chakravarty, T.
Bhattacharyya, A.B.
Keywords: Analytical modelling
Plane aperture
Issue Date: 2007
Publisher: Jaypee University of Information Technology, Solan, H.P.
Abstract: High-speed multichip module interconnects are characterised by planar transmission lines. An interconnect line with ground plane aperture is essentially a microstrip line with partially removed ground plane below the line. The authors report the closed-form analytical expressions for line capacitance and characteristic impedance of microstrip interconnect line with a ground plane aperture. The expressions have been obtained using variational analysis combined with transverse transmission line technique. The closedform expressions are general and are obtained for a range of structure parameters and the dielectric constants. Results are compared with finite-difference time-domain simulations and measurements performed on a vector network analyser. The proposed study can find applications in the design of high-speed interconnects for printed circuit boards, radio frequency (RF) and multichip module applications. These are particularly useful where high impedance lines are required.
URI: http://ir.juit.ac.in:8080/jspui/jspui/handle/123456789/9227
Appears in Collections:Journal Articles



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